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High quality factor fractal inductor with complementary split-ring array inclusion

Akhendra Kumar Padavala (Department of Electronics and Communication Engineering, Shri Vishnu Engineering College for Women, Vishnupur, India)
Narayana Kiran Akondi (Department of Electronics and Communication Engineering, Shri Vishnu Engineering College for Women, Vishnupur, India)
Bheema Rao Nistala (Department of Electronics and Communication Engineering, National Institute of Technology, Warangal, India)

Circuit World

ISSN: 0305-6120

Article publication date: 28 February 2020

Issue publication date: 18 June 2020

142

Abstract

Purpose

This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface.

Design/methodology/approach

Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value.

Findings

The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally.

Practical implications

The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design.

Originality/value

Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.

Keywords

Citation

Padavala, A.K., Akondi, N.K. and Nistala, B.R. (2020), "High quality factor fractal inductor with complementary split-ring array inclusion", Circuit World, Vol. 46 No. 3, pp. 215-219. https://doi.org/10.1108/CW-06-2019-0052

Publisher

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Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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