Design of a high gain equilateral triangular microstrip patch antenna array (ETMPAA) on FR4 substrate using microstrip feed

Abstract

Purpose

The purpose of this paper is to discuss and analyze a microstrip feed equilateral triangular microstrip array antenna (ETMPAA) that is proposed for S band (3 GHz) applications.

Design/methodology/approach

The ETMPAA comprises three equilateral triangular patches with equal distance. The size of the antenna is 49.4 mm (0.0494 m)×18.4 mm (0.184 m). The proposed antenna has been designed by etching triangular shape structure on glass epoxy substrate (FR4).

Findings

The simulated result shows that ETMPAA has the impedance bandwidth of 900 MHz and the bandwidth can be achieved by controlling the gap between the patch antennas. The antenna is fed by microstrip feeding technique. Design of an antenna using advanced design system (ADS), based on finite element methods (FEM) has been used to analyze and optimize the antenna. Based on the measurement results an antenna proposed with maximum efficiency and maximum gain.

Originality/value

This paper fulfils an identified need to study a microstrip feed ETMPAA is proposed for S band (3 GHz) applications.

Citation

Alagarsamy, M., Sangareswaran, U.M. and Dhanaraj, P. (2016), "Design of a high gain equilateral triangular microstrip patch antenna array (ETMPAA) on FR4 substrate using microstrip feed", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 35 No. 5, pp. 1538-1549. https://doi.org/10.1108/COMPEL-11-2015-0424