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Embedded order reduction of hierarchical systems within an mCCM framework

Michael Popp (Institute of Theoretical Electrical Engineering, Leibniz Universität Hannover, Hannover, Germany)
Wolfgang Mathis (Institute of Theoretical Electrical Engineering, Leibniz Universität Hannover, Hannover, Germany)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 17 August 2018

Issue publication date: 16 October 2018

101

Abstract

Purpose

The purpose of this paper is to present the embedding of linear and nonlinear order reduction methods in a theoretical framework for handling hierarchically interconnected dynamical systems.

Design/methodology/approach

Based on the component connection modeling (CCM), a modified framework called mCCM for describing interconnected dynamic systems especially with hierarchical structures is introduced and used for order reduction purposes. The balanced truncation method for linear systems and the trajectory piecewise linear reduction scheme are used for the order reduction of systems described within the mCCM framework.

Findings

It is shown that order reduction methods can be embedded into the context of interconnected dynamical systems with the benefit of having a further degree of freedom in form of the hierarchical level, on which the order reduction is performed.

Originality/value

The aspect of hierarchy within system descriptions is exploited for order reduction purposes. This distinguishes the presented approach from common methods, which already start with single large-scale systems without explicitly considering hierarchical structures.

Keywords

Acknowledgements

The authors would like to thank the Volkswagen Foundation for the financial support of this work within the project AMSES (Aggregated Models for the Simulation of Electromechanical Power Systems).

Citation

Popp, M. and Mathis, W. (2018), "Embedded order reduction of hierarchical systems within an mCCM framework", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 37 No. 4, pp. 1535-1544. https://doi.org/10.1108/COMPEL-09-2017-0375

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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