To read this content please select one of the options below:

Design and simulation of electro-thermal compliant MEMS logic gates

Pandiyan P. (Department of Electrical and Electronics Engineering, Sri Ramakrishna Institute of Technology, Coimbatore, India)
Uma G. (Department of Instrumentation and Control Engineering, National Institute of Technology, Tiruchirappalli, India)
Umapathy M. (Department of Instrumentation and Control Engineering, National Institute of Technology, Tiruchirappalli, India)

Abstract

Purpose

The purpose of this paper is to design an out-of-plane micro electro-thermal-compliant actuator based logic gates which work analogously to complementary metal oxide semiconductor (CMOS) based logic gates. The proposed logic gates used a single-bit mechanical micro ETC actuator per logic instead of using 6-14 individual transistors as in CMOS.

Design/methodology/approach

A complete analytical modelling is performed on a single ETC vertical actuator, and a relation between the applied voltage and the out-of-plane deflection is derived. Its coupled electro-thermo-mechanical analysis is carried out using micro electro mechanical system (MEMS) CAD tool CoventorWare to illustrate its performance.

Findings

This paper reports analytical and numerical simulation of basic MEMS ETC actuator-based logic gates. The proposed logic gate operates on 5 V, which suits well with conventional CMOS logic, which in turn reduces the power consumption of the device.

Originality/value

The proposed logic gates uses a single-bit MEMS ETC actuator per logic instead of using more transistors as in CMOS. The unique feature of this proposed logic gates is that the basic mechanical ETC actuator is customized in its structure to function as specific logic gates depending upon the given inputs.

Keywords

Citation

P., P., G., U. and M., U. (2018), "Design and simulation of electro-thermal compliant MEMS logic gates", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 37 No. 2, pp. 868-889. https://doi.org/10.1108/COMPEL-08-2017-0325

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

Related articles