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Optimization of the shape of an induction heating device in the presence of skin effect in the coils

Giovanni Aiello (Dipartimento di Ingegneria Elettrica, Elettronica e Informatica (DIEEI), Universita degli Studi di Catania, Catania, Italy)
Salvatore Alfonzetti (Dipartimento di Ingegneria Elettrica, Elettronica e Informatica (DIEEI), Universita degli Studi di Catania, Catania, Italy)
Santi Agatino Rizzo (Dipartimento di Ingegneria Elettrica, Elettronica e Informatica (DIEEI), Universita degli Studi di Catania, Catania, Italy)
Nunzio Salerno (Dipartimento di Ingegneria Elettrica, Elettronica e Informatica (DIEEI), Universita degli Studi di Catania, Catania, Italy)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 29 November 2019

Issue publication date: 20 May 2020

95

Abstract

Purpose

The optimization of the cross section of an axisymmetric induction heating device is performed by means of genetic algorithms (GAs).

Design/methodology/approach

The hybrid finite element method–Dirichlet boundary condition iteration method is used to deal with the unbounded nature of the field. The formulation of the electromagnetic problems takes into account skin and proximity effects in the source currents.

Findings

The convergence of GAs towards the optimum is very fast, since less than a thousand analyses have been necessary.

Originality/value

A special derivation of the finite element global system is presented which allows us to save computing time.

Keywords

Acknowledgements

This paper forms part of a special section “12th International Conference on Scientific Computing in Electrical Engineering (SCEE 2018)”, guest edited by Vittorio Romano.

Citation

Aiello, G., Alfonzetti, S., Rizzo, S.A. and Salerno, N. (2020), "Optimization of the shape of an induction heating device in the presence of skin effect in the coils", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 39 No. 2, pp. 525-531. https://doi.org/10.1108/COMPEL-06-2019-0251

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

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