TY  - JOUR
AB  - Purpose– The substrate coupling and loss in integrated circuits are analyzed. Then, the authors extract impedances between any numbers of embedded contacts. The paper aims to discuss these issues. Design/methodology/approach– The paper proposes a new substrate network 3D extraction technique, adapted from a transmission line method or Green kernels, but in the whole volume. Findings– Extracting impedances between any numbers of embedded contacts with variable shapes or/and through silicon via. This 3D method is much faster comparing with FEM Originality/value– Previous works consider TSVs alone, contacts onto the substrate. The authors do study entanglement between the substrate and the interconnections.
VL  - 33
IS  - 4
SN  - 0332-1649
DO  - 10.1108/COMPEL-06-2013-0201
UR  - https://doi.org/10.1108/COMPEL-06-2013-0201
AU  - Sun Fengyuan
AU  - Lorival Jean-Etienne
AU  - Calmon Francis
AU  - Gontrand Christian
PY  - 2014
Y1  - 2014/01/01
TI  - Through silicon vias: from a physical point of view to a compact models initiation
T2  - COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering
PB  - Emerald Group Publishing Limited
SP  - 1462
EP  - 1484
Y2  - 2024/04/25
ER  -