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Analytical modelling of the transient thermal field of a tubular bus in nominal rating

Jerzy Gołębiowski (Department of Electrical Engineering, Bialystok University of Technology, Bialystok, Poland)
Marek Zaręba (Department of Electrical Engineering, Bialystok University of Technology, Bialystok, Poland)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 28 March 2019

Issue publication date: 20 May 2019

76

Abstract

Purpose

The purpose of this paper is to analyse the dynamics of a thermal field generated in a tubular bus with rated current by using two models of electrical resistivity of copper.

Design/methodology/approach

The boundary-initial problem of the modified heat equation was formulated for the tubular bus. Analytical solutions were obtained by means of Green’s functions as the kernels of the integral operator inverse to the corresponding differential operator. The results were presented graphically and verified using the finite element method. The calculations were made by considering the example of the Storm Power Components tubular bus (USA).

Findings

Analytical field models were used to determine time- and space-variable heating curves, time constants and steady-state current ratings.

Research limitations/implications

This paper is related to the structure of a hollow cylinder. Other bus sections can be taken into account by using the coordinate systems of different curvilinear orthogonal symmetry.

Originality/value

Using the analytical method, the influence of the variable (temperature dependent) electrical resistivity on some important parameters and characteristics of the tubular bus was investigated. The system was considered as an element with distributed parameters.

Keywords

Citation

Gołębiowski, J. and Zaręba, M. (2019), "Analytical modelling of the transient thermal field of a tubular bus in nominal rating", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 38 No. 2, pp. 642-656. https://doi.org/10.1108/COMPEL-02-2018-0078

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

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