It is well known that stress singularity may exist at the edges of a bonded bi‐material interface due to the discontinuity of material properties. This stress singularity causes difficulty in accurately determining the bi‐material interface bonding strength. This paper aims to present a new design of specimen geometry to eliminate the stress singularity and present an experimental procedure to more accurately determine the bonding strength of the bi‐material interface.
The design is based on an asymptotic analysis of the stress field near the free edge of bi‐material interface. The critical bonding angle, which delineates the singular and non‐singular stress field near the free edge, is determined.
With the new designed specimen and a special iterative calculation algorithm, the interface bonding strength envelope of an epoxy‐aluminum interface was experimentally determined.
This new design of specimen, experimental procedure and iterative algorithm may be applied to obtain more reasonable and accurate bonding strength data for a wide range of bi‐material interfaces.
Chowdhuri, M. and Xia, Z. (2012), "Theory and experimental method to determine bonding strength envelope of bi‐material interface", International Journal of Structural Integrity, Vol. 3 No. 4, pp. 409-423. https://doi.org/10.1108/17579861211281209Download as .RIS
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