TY  - JOUR
AB  - The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work‐order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the ICD packaging industry, this work also proposes a WIP (i.e. work‐in‐process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.
VL  - 6
IS  - 3
SN  - 1598-2688
DO  - 10.1108/15982688200500024
UR  - https://doi.org/10.1108/15982688200500024
AU  - Lin Long‐Chin
AU  - Chen Wen‐Chin
AU  - Sun Chin‐Huang
AU  - Tsai Chih‐Hung
PY  - 2005
Y1  - 2005/01/01
TI  - Developing a Data Model of Product Manufacturing Flow for an IC Packaging WIP System
T2  - Asian Journal on Quality
PB  - Emerald Group Publishing Limited
SP  - 70
EP  - 94
Y2  - 2024/04/25
ER  -