The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work‐order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the ICD packaging industry, this work also proposes a WIP (i.e. work‐in‐process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.
Lin, L., Chen, W., Sun, C. and Tsai, C. (2005), "Developing a Data Model of Product Manufacturing Flow for an IC Packaging WIP System", Asian Journal on Quality, Vol. 6 No. 3, pp. 70-94. https://doi.org/10.1108/15982688200500024Download as .RIS
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