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The Application of Machine Vision to IC Surface Inspection

Yi‐Chan Chung (Department of Industrial Engineering and Management, Ta‐Hwa Institute of Technology, 1 Ta‐Hwa Road, Chung‐Lin, Hsin‐Chu, Taiwan, ROC)
Chih‐Hung Tsai (Department of Industrial Engineering and Management, Ta‐Hwa Institute of Technology, 1 Ta‐Hwa Road, Chung‐Lin, Hsin‐Chu, Taiwan, ROC)
Yu‐Tang Lin (Department of Industrial Engineering and Management, Ta‐Hwa Institute of Technology, 1 Ta‐Hwa Road, Chung‐Lin, Hsin‐Chu, Taiwan, ROC)

Asian Journal on Quality

ISSN: 1598-2688

Article publication date: 21 August 2003

70

Abstract

During IC inspection, which includes the two parts of Mark and Lead, the deviation of IC on the tape occurring in high speed movements usually generates light reflection effect, which in turn causes errors in IC recognition as measured by machine vision system. this research filters the light reflection effect by developing standard components, identifies the correct position of IC Lead, hence fixes the measurement errors or non‐measurability caused by light reflection, avoids the resulting discontinued operation of measuring system, and improves the productivity.

Keywords

Citation

Chung, Y., Tsai, C. and Lin, Y. (2003), "The Application of Machine Vision to IC Surface Inspection", Asian Journal on Quality, Vol. 4 No. 2, pp. 50-64. https://doi.org/10.1108/15982688200300019

Publisher

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MCB UP Ltd

Copyright © 2003, MCB UP Limited

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