The effect of thermal relaxation times on wave propagation of micropolar thermoelastic medium with voids due to various sources

Abstract

Purpose

The purpose of this paper is to formulate a model of the equations of a two‐dimensional problem with the deformation of micropolar generalized thermoelastic medium with voids under the influence of various sources in the context of the Lord‐Shulman, Green‐Lindsay theories, as well as the classical dynamical coupled theory.

Design/methodology/approach

The normal mode analysis was used to obtain the exact expressions of the displacement components, force stress, coupled stress, change in volume fraction field and temperature distribution. Numerical results were given and illustrated graphically when the volume source was applied.

Findings

The presence of voids plays a significant role on all the physical quantities. The value of normal displacement and normal force stress increases while the temperature, tangential force stress and the couple stress increase and then decrease due to the presence of voids. The value of all the physical quantities converges to zero with increase in distance z.

Originality/value

Comparisons are made with the results predicted by the three theories in the presence and the absence of material constants due to voids.

Citation

Othman, M.I.A. and Lotfy, K. (2010), "The effect of thermal relaxation times on wave propagation of micropolar thermoelastic medium with voids due to various sources", Multidiscipline Modeling in Materials and Structures, Vol. 6 No. 2, pp. 214-228. https://doi.org/10.1108/15736101011068000