Modeling of plated through hole reliability and performance

Abstract

Purpose

The purpose of this paper is to evaluate modeling of the reliability characteristics of the copper (Cu) used in plated through holes (PTHs) for electrical connections across printed circuit boards (PCBs).

Design/methodology/approach

Assessments of the Cu damage in the first three reflow cycles are performed using finite element analysis. A two‐dimensional axi‐symmetric model of a PTH on a laminate board is validated against a three‐dimensional full model and test cases. Stress and strain measurements in the inner ring of the PTH are obtained in numerical simulations.

Findings

Loads applied after the reflow cycles contribute to subsequent mechanical disconnects. Reliability assessments relying on undamaged circuits are less accurate than estimates incorporating Cu damage following three reflow cycles.

Originality/value

In order to increase the accuracy of PCB reliability predictions significantly, prior‐to‐use damage should be calculated. In this paper, a modification to the reliability analysis is proposed.

Citation

Sharon, G. and Barker, D. (2011), "Modeling of plated through hole reliability and performance", Multidiscipline Modeling in Materials and Structures, Vol. 7 No. 3, pp. 306-317. https://doi.org/10.1108/1536-540911178261