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Low cost high performance microwave structures fabricated by advanced thick film techniques

Barbara Dziurdzia (Department of Electronics, University of Mining and Metallurgy, Cracow, Poland)
Stanislaw Nowak (Department of Electronics, University of Mining and Metallurgy, Cracow, Poland)
Michal Ciez (R&D Centre for Hybrid Microelectronics and Resistors, Cracow, Poland)
Wojciech Gregorczyk (Telecommunications Research Institute, Warsaw, Poland)
Heiko Thust (Technical University of Ilmenau, Germany)
Erich Polzer (Du Pont de Nemours GmbH, Bad Homburg, Germany)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 1999

862

Abstract

The paper presents the application of two advanced thick‐film techniques: etching of fired thick‐films and photoimaging of photosensitive thick‐films for fabrication bandpass microwave filters operating in the frequency range from 6 to 14 GHz. Modified screen printing through ultra‐thin calendered screens is used for comparative goals. Advanced techniques are combined with novel thick‐film conductors including photosensitive pastes and etchable pastes.

Keywords

Citation

Dziurdzia, B., Nowak, S., Ciez, M., Gregorczyk, W., Thust, H. and Polzer, E. (1999), "Low cost high performance microwave structures fabricated by advanced thick film techniques", Microelectronics International, Vol. 16 No. 3, pp. 46-53. https://doi.org/10.1108/13565369910293350

Publisher

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MCB UP Ltd

Copyright © 1999, MCB UP Limited

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