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HDI substrate technology for electronic automotive applications

M. Bremond (Bull Electronics, Angers, France)
D. Lambert (Bull SA, Les Clayes sous Bois, France)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 1999

1429

Abstract

Presents a survey of build‐up technologies based on the manufacture of microvia in thin dielectric sheets (< 100µm) deposited on PWB materials. These technologies will permit the PWB industry to manufacture high density interconnect substrates and answer the routeing requirements of high number I/Os, BGAs and new area array components. Bull Electronics Angers (BEA) has developed an HDI technology where microvias with hole diameters lower than 100µm are mechanically or laser drilled and interconnected lines at pitch down to 200µm are manufactured. In the frame of a European MEDEA project, ATEMAES, the design of an electronic subsystem manufactured by Magnetti Marelli in ceramic thick film technology has been adapted to the design rules of the HDI technology developed by Bull. This is part of an evaluation program for the use of HDI technology for automotive applications.

Keywords

Citation

Bremond, M. and Lambert, D. (1999), "HDI substrate technology for electronic automotive applications", Microelectronics International, Vol. 16 No. 3, pp. 36-38. https://doi.org/10.1108/13565369910293323

Publisher

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MCB UP Ltd

Copyright © 1999, MCB UP Limited

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