Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Abstract

Reports the research and development results on flip chip on FR‐4 and ceramics, using anisotropic conductive film (ACF), anisotropic conductive paste (ACP), or eutectic solder with underfill. Several types of ACF and ACP with different types of conductive particles and adhesives were investigated. Simple but high yield procedures for reworking flip chip on board using ACP and ACF were developed. Processes for flip chip on FR‐4 and ceramic boards using eutectic solder bumps with underfill were also evaluated. The flip chips were assembled on test vehicles for temperature cycling and high‐temperature high‐humidity tests. The reliability performance of the three processes (gold bumps with ACF, gold bumps with ACP, and eutectic solder bumps with underfill) is compared.

Citation

Zhong, Z. (1999), "Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill", Microelectronics International, Vol. 16 No. 3, pp. 6-14. https://doi.org/10.1108/13565369910293297