Interconnect solutions for advanced area array packaging

Abstract

CSP (chip scale packaging) and flip chip area array technologies are emerging within the electronics packaging industry to provide solutions capable of fulfilling the technological demands of computer, telecom and consumer electronic products. However, the full potential of area array attach can only be realised if the next level of interconnect is capable of supporting the fine pitch and high I/O characteristics of emerging CSP and flip chip technology. Celestica has addressed this issue by investigating next generation printed circuit board (PCB) technology, to assess the capability of organic based laminate as a high density interconnect. This paper describes the manufacturing experiments performed to produce a laser microvia interconnect solution. The mechanical performance of the interconnect is also presented to confirm its compatibility with area array assembly.

Citation

Hendriksen, M.W., Frimpong, F.K. and Ekere, N.N. (1999), "Interconnect solutions for advanced area array packaging", Microelectronics International, Vol. 16 No. 2, pp. 49-54. https://doi.org/10.1108/13565369910268277