Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications
Article publication date: 1 August 1999
Reviews the traditional use of thermoset (epoxy) adhesives for various bonding applications and highlights some limitations in today’s microelectronics arena. In particular, concerns for thermal and stress management associated with large area silicon bonded to a wide variety of substrate materials has led to an increasing interest in thermoplastic adhesive technology. Thermoplastics are not always the best solution for every application. This paper sets out to address the “pros and cons” of each polymer technology for different microelectronic applications taking into account some of the key physical properties such as Tg, TCE and modulus. In addition, practical issues such as handling, storage and processing are considered in detail.
Gilleo, K. and Ongley, P. (1999), "Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications", Microelectronics International, Vol. 16 No. 2, pp. 34-38. https://doi.org/10.1108/13565369910268259
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