Abstract
The effect of heat‐spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost‐effective cavity‐down plastic ball grid array (PBGA) packages assembled on an FR‐4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35mm and 40 × 40mm and with four and five rows of solder balls.
Keywords
Citation
Lau, J. and Chen, T. (1999), "Effect of heat‐spreader sizes on the thermal performance of large cavity‐down plastic ball grid array packages ‐ NuCSP", Microelectronics International, Vol. 16 No. 2, pp. 24-33. https://doi.org/10.1108/13565369910268240
Publisher
:MCB UP Ltd
Copyright © 1999, MCB UP Limited