Higher yields and reliability with automated assembly of microwave modules

Abstract

Microwave modules and hybrid circuits have some unique requirements that demand extremely precise dispensing and placement, delicate handling and well controlled curing (or reflow). Assembly of these products can be challenging and defects may result in labor‐intensive manual assembly methods. A better way is to apply automated manufacturing techniques to the assembly of microwave modules and hybrid circuits and thereby eliminate many of the variables that may narrow the process window.

Citation

Chalsen, M. and Crowley, D. (1999), "Higher yields and reliability with automated assembly of microwave modules", Microelectronics International, Vol. 16 No. 1, pp. 12-17. https://doi.org/10.1108/13565369910250032