Frits in thick film superconductors: a special approach for improving superconducting and adhesion properties

Abstract

Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising.

Citation

Harsányi, G., Liu, Y. and Kinzy Jones, W. (1998), "Frits in thick film superconductors: a special approach for improving superconducting and adhesion properties", Microelectronics International, Vol. 15 No. 3, pp. 22-25. https://doi.org/10.1108/13565369810233113