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Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA

John H. Lau (Express Packaging Systems Inc., Palo Alto, California, USA)
K.L. Chen (Express Packaging Systems Inc., Palo Alto, California, USA)
F. Wu (Express Packaging Systems Inc., Palo Alto, California, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1998

266

Abstract

NuBGA is a low‐cost, single‐core, two‐metal layer, cavity‐down plastic ball grid array package. With special design concepts, NuBGA provides electrical and thermal enhancements for electronic packaging applications. The concepts of these innovative designs are briefly described. Thermal resistance of junction to air is investigated first by finite element simulations, and the results are then compared to experimental measurements. Also, thermal measurements are carried out for both with, and without, heat sink attachment. Geometric dependence of thermal resistance on structural parameters such as thickness of the copper heat spreader and organic substrate, power and ground planes in printed circuit board (PCB), and the size of PCB are also discussed.

Keywords

Citation

Lau, J.H., Chen, K.L. and Wu, F. (1998), "Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA", Microelectronics International, Vol. 15 No. 2, pp. 25-33. https://doi.org/10.1108/13565369810215609

Publisher

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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