TY  - JOUR
AB  - A straightforward flip‐chip mounting technique is described using gold bumps, a silicon motherboard and non‐conductive adhesives to fabricate electro‐optical modules coupling light from arrays of laser diodes into arrays of fibres. This enables the fabrication of non‐hermetic, potentially cheap modules for short‐distance, parallel‐optical interconnection. As an application, the realisation of a compact, active electro‐optical dipole and loop probe is presented. During assembly of the probes, attention was paid to sensitivity, susceptibility to interfering electromagnetic fields and to high‐frequency behaviour. The probes show sensitivities comparable with, or better than, conventional probes of the same size. They show a linear dynamic behaviour of at least 60dB, and measure electric fields up to 30mV/m or magnetic fields up to 0.1mA/m, respectively. The antenna signal modulates the optical signal of a biased laser diode, and because all the spectral information of the electromagnetic field is preserved during measurement, these probes are excellent instruments for diagnostic EMC‐measurements with a high spatial resolution.
VL  - 15
IS  - 1
SN  - 1356-5362
DO  - 10.1108/13565369810199095
UR  - https://doi.org/10.1108/13565369810199095
AU  - Vanwassenhove Luc
PY  - 1998
Y1  - 1998/01/01
TI  - Low‐cost fibre‐chip coupling for electro‐optic EMC‐probes
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 32
EP  - 34
Y2  - 2024/04/25
ER  -