Thermodynamic aspect of the wire‐bonding process

J. Falk (Degussa AG, Rheinfelden, Germany)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 1998

Abstract

The influence of process heat, with regard to wire‐ and substrate‐materials, on the adhesion of wire‐bonds was investigated. Temperature increases up to 200°C were measured on the interface between surface and wire. This temperature is the basis for demonstrating the important influence of dissipated process heat on the cold welding process of wire‐bonding. Complementary calculations to evaluate the equation of thermal conductivity were carried out using the finite element (FE) method. Bonding tests were able to verify the calculations. These thermodynamical considerations give us a new method to optimize the construction and the choice of materials within the wire‐bond process.

Keywords

Citation

Falk, J. (1998), "Thermodynamic aspect of the wire‐bonding process", Microelectronics International, Vol. 15 No. 1, pp. 23-31. https://doi.org/10.1108/13565369810199086

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Publisher

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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