A comparative analysis of interconnection technologies for integrated multilayer inductors

Stephen O’ Reilly (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)
John Flannery (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)
Terence O’ Donnell (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)
Andrew Muddiman (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)
Gerard Healy (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)
Michael Byrne (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)
Sean Cian Ó Mathúna (PEI Technologies, National Microelectronics Research Centre, University College, Cork, Ireland)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 1998

Abstract

Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine‐line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self‐resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.

Keywords

Citation

O’ Reilly, S., Flannery, J., O’ Donnell, T., Muddiman, A., Healy, G., Byrne, M. and Cian Ó Mathúna, S. (1998), "A comparative analysis of interconnection technologies for integrated multilayer inductors", Microelectronics International, Vol. 15 No. 1, pp. 6-10. https://doi.org/10.1108/13565369810199059

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Publisher

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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