Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine‐line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self‐resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.
O’ Reilly, S., Flannery, J., O’ Donnell, T., Muddiman, A., Healy, G., Byrne, M. and Cian Ó Mathúna, S. (1998), "A comparative analysis of interconnection technologies for integrated multilayer inductors", Microelectronics International, Vol. 15 No. 1, pp. 6-10. https://doi.org/10.1108/13565369810199059Download as .RIS
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