Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip

Abstract

The electronics packaging industry is debating whether CSP, Chip Scale Packaging, or flip chip is going to become the major alternative for future products. The user wants more functionality and portability at an ever increasing speed and the need for denser packaging is becoming urgent. The issue of acquiring adequate circuit boards is pressing. However, the comparison between CSP and flip chip is not straightforward, since many CSPs are really flip chips in small packages. CSPs therefore, do not compare with flip chip on board but with packaged die.

Citation

Boustedt, K. and Vardaman, E.J. (1997), "Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip", Microelectronics International, Vol. 14 No. 3, pp. 31-32. https://doi.org/10.1108/13565369710800547