TY  - JOUR
AB  - Conductive adhesive alternatives to tin/lead soldering have mainly concentrated on
isotropic silver‐filled epoxy resins. These thermosetting polymers do not offer a universally
successful solution and this may be fundamental to the use of epoxy itself. Another route being developed in a joint programme between Multicore Solders Ltd and Diemat, Inc.,
is based on thermoplastic polymers and offers benefits in the areas of reworkability, low modulus, low
joint stress and possibly environmental stability. The novel process for compounding with silver can
produce an order of magnitude improvement in electrical and thermal conductivity compared with
typical epoxy/silver formulations, and initial environmental reliability data demonstrate compatibility
with tin/lead coated components and board finish. A current application
is outlined where a Hi‐Rel silicon on silicon hybrid (MCM) is realised using the
silver/thermoplastic adhesive for both semiconductor die and passive chip components.
VL  - 14
IS  - 2
SN  - 1356-5362
DO  - 10.1108/13565369710800484
UR  - https://doi.org/10.1108/13565369710800484
AU  - Firmstone M.G.
AU  - Bartholomew P.M.
AU  - Paterson G.
AU  - Dietz R.
AU  - Robinson P.
PY  - 1997
Y1  - 1997/01/01
TI  - Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 16
EP  - 21
Y2  - 2024/05/03
ER  -