As plastic ball grid array (PBGA) components proliferate, card assembly questions arise about the robustness of the module to card attachment process. A designed experiment was performed to measure the sensitivity of card assembly yields to normal assembly process variation. Experimental variables include card thickness, ball pad size on the card ball grid array (BGA) site, module moisture exposure and ball planarity of a 225 I/O PBGA. Another set of PBGA test cards, assembled under optimum process conditions, was subjected to accelerated thermal cycle (ATO) testing. ATC testing also included a rework cell. Overall, the PBGA module attachment process demonstrated robustness. The initial attach and reworked modules proved to be reliable. This paper focuses on the details of the test conditions and the results.
Anderson, L. and Primavera, A. (1997), "Plastic Ball Grid Array Attachment: Assembly and Reliability Performance", Microelectronics International, Vol. 14 No. 2, pp. 11-15. https://doi.org/10.1108/13565369710800475Download as .RIS
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