TY  - JOUR
AB  - Plastic ball grid arrays (PBGAs) have begun to gain popularity in the electronic packaging market
because of their advantages over peripheral leaded devices. In addition to good electrical
performance, the PBGAs offer advantages to the assembler. The development of a successful
assembly process for PBGAs requires an understanding of the PBGA itself and the assembly process.The key attributes required for high yield manufacturing of PBGAs are discussed. The emphasis is
placed on the PBGA assembly parameters including proper PBGA handling, printing , stencil design,
placement, reflow and inspection. This paper is intended to increase the understanding of the plastic ball grid array manufacturing process.
VL  - 14
IS  - 1
SN  - 1356-5362
DO  - 10.1108/13565369710800457
UR  - https://doi.org/10.1108/13565369710800457
AU  - Hill G.
PY  - 1997
Y1  - 1997/01/01
TI  - The Analysis of Manufacturing Processes for Plastic Ball Grid
Arrays (PBGAs)
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 16
EP  - 19
Y2  - 2024/04/19
ER  -