Plastic ball grid arrays (PBGAs) have begun to gain popularity in the electronic packaging market because of their advantages over peripheral leaded devices. In addition to good electrical performance, the PBGAs offer advantages to the assembler. The development of a successful assembly process for PBGAs requires an understanding of the PBGA itself and the assembly process. The key attributes required for high yield manufacturing of PBGAs are discussed. The emphasis is placed on the PBGA assembly parameters including proper PBGA handling, printing , stencil design, placement, reflow and inspection. This paper is intended to increase the understanding of the plastic ball grid array manufacturing process.
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