Achieving Low Moisture Levels in Hermetic Packages containing Silver Glass with Organic Solvent Die Attach Materials

Abstract

For a considerable time moisture level has been a problem for hermetic package assembly, although the materials used were only metallics. Today semiconductor technology is cost driven, therefore organic materials must be taken into account. Obviously there are many different issues involved. This paper focuses on mechanisms involving hermetic packages with silver glass die attach material. Silver glass, as a die attach paste, is mixed with organic solvents, so different chemical reactions are studied. It is then shown how to achieve a low moisture level. the authors' company has performed a design of experiments (DoX) in order to identify the key parameters and their interactions. A mathematical prediction model has been determined, and the result of this theoretical study is confirmed with experimental results.

Citation

Coupier, P., Peltier, J.P. and Pilat, E. (1997), "Achieving Low Moisture Levels in Hermetic Packages containing Silver Glass with Organic Solvent Die Attach Materials", Microelectronics International, Vol. 14 No. 3, pp. 54-56. https://doi.org/10.1108/13565369710195306