TY  - JOUR
AB  - Polyimide deposition of thick layers (50‐60 μm after
soft‐bake) is very important in the field of microelectronics; in particular for fabrication of microwave
circuits for telecommunications, micromachining applications, MCM‐D and, in general, for pattern
transfer. Spin coating is, even in this case, the only method that can provide good results in terms of
quality, repeatability and reliability. This paper discusses problems concerning the
polyimide deposition process for obtaining thick layers with an uniformity value within 10% and
studying the process itself from a mathematical point of view. In particular, the thickness variation
versus frequency has been analysed, checking the mathematical model in which the dependence is ω−K(K=0.5). It is shown that the polyimide behaves differently depending on the residual
solvents at the end of the process and that the model is verified only if the solvents are completely
evaporated at the end of the process also. This resolves a certain confusion in the literature where the
value of K changes from 0.5 to 1 with different justifications.
VL  - 13
IS  - 3
SN  - 1356-5362
DO  - 10.1108/13565369610800377
UR  - https://doi.org/10.1108/13565369610800377
AU  - Borsetto M.
AU  - Carcano G.
AU  - Ceriani M.
PY  - 1996
Y1  - 1996/01/01
TI  - Spin Coating Study for Thick Layers with High Viscosity Polyimide
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 30
EP  - 32
Y2  - 2024/09/26
ER  -