TY  - JOUR
AB  - Taguchi methods were applied to the
production of thin RF integrated circuits on alumina. The substrates had 20 via holes of 1 mm in
diameter, which led to a perturbation to the homogeneous spread of photoresist (by spinning) adjacent
to the holes. Consequently, the overall process yield was 30%. Implementation of Taguchi methods
resulted in a substantial increase in production yield — to a value of 90%, which was obtained
repeatedly. Thus, a robust cost‐effective process was achieved.
VL  - 13
IS  - 3
SN  - 1356-5362
DO  - 10.1108/13565369610800368
UR  - https://doi.org/10.1108/13565369610800368
AU  - Klein I.E.
PY  - 1996
Y1  - 1996/01/01
TI  - Application of Taguchi Methods to the Production of Integrated Circuits
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 12
EP  - 14
Y2  - 2024/05/06
ER  -