Taguchi methods were applied to the production of thin RF integrated circuits on alumina. The substrates had 20 via holes of 1 mm in diameter, which led to a perturbation to the homogeneous spread of photoresist (by spinning) adjacent to the holes. Consequently, the overall process yield was 30%. Implementation of Taguchi methods resulted in a substantial increase in production yield — to a value of 90%, which was obtained repeatedly. Thus, a robust cost‐effective process was achieved.
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