Application of Taguchi Methods to the Production of Integrated Circuits

I.E. Klein (RAFAEL Department of Materials and Processes, Haifa, Israel)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 December 1996


Taguchi methods were applied to the production of thin RF integrated circuits on alumina. The substrates had 20 via holes of 1 mm in diameter, which led to a perturbation to the homogeneous spread of photoresist (by spinning) adjacent to the holes. Consequently, the overall process yield was 30%. Implementation of Taguchi methods resulted in a substantial increase in production yield — to a value of 90%, which was obtained repeatedly. Thus, a robust cost‐effective process was achieved.



Klein, I. (1996), "Application of Taguchi Methods to the Production of Integrated Circuits", Microelectronics International, Vol. 13 No. 3, pp. 12-14.

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Copyright © 1996, MCB UP Limited

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