Fine‐line Passive Components for Hybrid Microelectronics
Article publication date: 1 December 1996
A laser ablation technique has been used to fabricate conductor patterns on a 96% alumina substrate to evolve passive fine‐line components and structures. This paper reports the method of fabricating better fine‐line passive components for hybrid microelectronics application. The effect of a laser beam on the conductor and 96% alumina (Al2O3) substrate was studied in detail. Three predominant structures — namely debris, ablation border and irradiated bottom layer — were seen on the patterns. A detailed study of the dendritic growth caused by electrochemical migration on conductor lines fabricated by conventional screen printing and by laser ablation techniques is also reported.
Kripesh, V., Bhatnagar, S.K., Osterwinter, H. and Gust, W. (1996), "Fine‐line Passive Components for Hybrid Microelectronics", Microelectronics International, Vol. 13 No. 3, pp. 9-11. https://doi.org/10.1108/13565369610800359
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