TY  - JOUR
AB  - The use of thermally conductive adhesives to
bond heat generatingdevicestoheat sinks is an alternative production method for thermal
management. It is of interest to be ableto predict the thermal conductivity of an adhesivebasedon
composition and rheology.A semi‐empirical model, for predicting
the thermal conductivity of binary mixtures can be enhanced by taking into account filler interactionswhich affect the rheological profile of the system. Combinations of thermally conductive fillers, which
can form structure within the polymer matrix, are shown to offer higher thermal conductivity. The Lewis
and Nielsen model, can be used to predict the thermal
conductivity of structured matrices by relating the rheology of the system to the effective aspect
ratio of the filler particle.
VL  - 13
IS  - 3
SN  - 1356-5362
DO  - 10.1108/13565369610800340
UR  - https://doi.org/10.1108/13565369610800340
AU  - Cross R.
PY  - 1996
Y1  - 1996/01/01
TI  - Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 27
EP  - 29
Y2  - 2024/04/25
ER  -