The use of thermally conductive adhesives to bond heat generating devices to heat sinks is an alternative production method for thermal management. It is of interest to be able to predict the thermal conductivity of an adhesive based on composition and rheology. A semi‐empirical model, for predicting the thermal conductivity of binary mixtures can be enhanced by taking into account filler interactions which affect the rheological profile of the system. Combinations of thermally conductive fillers, which can form structure within the polymer matrix, are shown to offer higher thermal conductivity. The Lewis and Nielsen model, can be used to predict the thermal conductivity of structured matrices by relating the rheology of the system to the effective aspect ratio of the filler particle.
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