TY  - JOUR
AB  - This research demonstrates how a low‐cost three‐dimensional packaging technology can be ultilised to implement heterogeneous microsystems. Systems which integrate sensors, actuators and signal processing are highly complex and often require
custom packaging to maximise their potential. Using a novel multichip module packaging technology, referred to as MCM‐V (multichip module‐vertical), it has been demonstrated that
three‐dimensional MCMs can be applied in the production of high‐density microsystems incorporating
sensors, bare die and discrete components. As an example, a microsystem which integrates an image
sensor and programmable processing resources is described. The microsystem represents the first
heterogeneous system to be produced using the advanced three‐dimensional technology (MCM‐V).
VL  - 13
IS  - 3
SN  - 1356-5362
DO  - 10.1108/13565369610800331
UR  - https://doi.org/10.1108/13565369610800331
AU  - Larcombe S.
AU  - Ivey P.
PY  - 1996
Y1  - 1996/01/01
TI  - An Ultra High Density Technology for Microsystems
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 15
EP  - 18
Y2  - 2024/04/19
ER  -