This research demonstrates how a low‐cost three‐dimensional packaging technology can be ultilised to implement heterogeneous microsystems. Systems which integrate sensors, actuators and signal processing are highly complex and often require custom packaging to maximise their potential. Using a novel multichip module packaging technology, referred to as MCM‐V (multichip module‐vertical), it has been demonstrated that three‐dimensional MCMs can be applied in the production of high‐density microsystems incorporating sensors, bare die and discrete components. As an example, a microsystem which integrates an image sensor and programmable processing resources is described. The microsystem represents the first heterogeneous system to be produced using the advanced three‐dimensional technology (MCM‐V).
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