Minimal Size Packaging Solutions: A Comparison

Abstract

Known good die, flip chip and chip scale packages are technologies that offer various advantages to the board manufacturer. A discussion of the different types of package options, their methods of assembly, test and performance comparisons can help to resolve the general direction a manufacturer might pursue for next generation systems. This paper attempts to give a perspective as well as highlighting the areas of concern with the different options.

Citation

Greathouse, S. (1996), "Minimal Size Packaging Solutions: A Comparison", Microelectronics International, Vol. 13 No. 2, pp. 27-32. https://doi.org/10.1108/13565369610800250