Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications

I.P. Hall (BT Laboratories, Ipswich, Suffolk, England)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 1996


The drive towards low unit cost in optoelectronic packaging is assisted by avoiding the need for hermeticity and by the use of simple assembly techniques. Silicone gels can solve this problem, provided the reliability meets the application requirements. Extensive lifetest data for semiconductor lasers and PIN photodiodes coated in silicone gels are reported in this paper. Results to date show great promise and promote confidence in the use of these materials for the environmental protection of optoelectronic devices. Apart from silicone gels, light cured resin materials can also offer benefits towards lower cost assembly processes. Tests are reported of the degradation in optical transmission of these resins and also bulk degradation under differing environmental conditions. The use of these polymer materials can play an integral part in low‐cost optoelectronic packaging developments, two specific designs of which — a silicon laser optical bench and a ceramic ferrule co‐axial structure — will be described. Both of these packages take advantage of a passive fibre/device alignment allowed by the use of an expanded beam laser design.



Hall, I. (1996), "Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications", Microelectronics International, Vol. 13 No. 1, pp. 6-10.

Download as .RIS




Copyright © 1996, MCB UP Limited

Please note you might not have access to this content

You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account.
If you would like to contact us about accessing this content, click the button and fill out the form.
To rent this content from Deepdyve, please click the button.