TY  - JOUR
AB  - This paper describes the processing and electrical
characterisation of an interconnection substrate technology called Combifilm. The study focuses on
digital applications. According to calculations, the conductivity of the reference plane is shown not to be
critical in the low gigahertz range. Electrical measurements were performed at low and high frequencies
(up to 5 GHz). Measurements of the attenuation were compared with calculations. Crosstalk
measurements were carried out from different line pitches and compared with numerical calculations. It
was determined that a line pitch of 300 μm would give sufficiently low crosstalk for many digital
applications. The SUSPENS model was used to estimate the performance of
different substrate technologies for modules with high speed ECL circuits. Two hypothetical systems
with different wiring demands were studied for each technology. For a module with low or moderate
wiring demands, Combifilm yielded a silicon efficiency (silicon‐to‐substrate
ratio) and a clock rate that were between the PCB‐based
chip‐on‐board technology and thin‐film multilayer technology. The estimated
clock rate was about 60% of that of the wire‐bonded thin‐film module. The
module size of Combifilm was shown to be sensitive to the wiring demand, and for a high wiring density
case the estimated size was approximately the same as for a chip‐on‐board module.
VL  - 13
IS  - 1
SN  - 1356-5362
DO  - 10.1108/13565369610800179
UR  - https://doi.org/10.1108/13565369610800179
AU  - Pedersen U.P.I.
AU  - Aaserud O.
AU  - Bungum O.W.
PY  - 1996
Y1  - 1996/01/01
TI  - Combifilm: A Novel Thick‐ and Thin‐film Technology with Two Signal Layers for High‐speed Hybrid Circuits Signal Layers for High‐speed Hybrid Circuits
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 16
EP  - 19
Y2  - 2024/04/19
ER  -