TY - JOUR AB - BGAs are a new type of surface mountable component. Successful industrial implementation of BGA assembly on electronic boards needs specific studies, evaluations and qualification. The methodology used in Bull is presented, along with an analysis of the different BGA types. Implementation and qualification results are provided. VL - 13 IS - 1 SN - 1356-5362 DO - 10.1108/13565369610800142 UR - https://doi.org/10.1108/13565369610800142 AU - Saint‐Martin X. AU - Stricot Y. AU - Auray M. AU - Floury C. PY - 1996 Y1 - 1996/01/01 TI - Are BGAs a Concern in SMT? A User’s Point of View T2 - Microelectronics International PB - MCB UP Ltd SP - 22 EP - 25 Y2 - 2024/03/29 ER -