Are BGAs a Concern in SMT? A User’s Point of View

X. Saint‐Martin (Bull, Les Clayes Sous Bois, France)
M. Auray (Bull Electronics Europe, Angers, France)
C. Floury (Bull Electronics Europe, Angers, France)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 1996

Abstract

BGAs are a new type of surface mountable component. Successful industrial implementation of BGA assembly on electronic boards needs specific studies, evaluations and qualification. The methodology used in Bull is presented, along with an analysis of the different BGA types. Implementation and qualification results are provided.

Keywords

Citation

Saint‐Martin, X., Stricot, Y., Auray, M. and Floury, C. (1996), "Are BGAs a Concern in SMT? A User’s Point of View", Microelectronics International, Vol. 13 No. 1, pp. 22-25. https://doi.org/10.1108/13565369610800142

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Publisher

:

MCB UP Ltd

Copyright © 1996, MCB UP Limited

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