BGAs are a new type of surface mountable component. Successful industrial implementation of BGA assembly on electronic boards needs specific studies, evaluations and qualification. The methodology used in Bull is presented, along with an analysis of the different BGA types. Implementation and qualification results are provided.
Saint‐Martin, X., Stricot, Y., Auray, M. and Floury, C. (1996), "Are BGAs a Concern in SMT? A User’s Point of View", Microelectronics International, Vol. 13 No. 1, pp. 22-25. https://doi.org/10.1108/13565369610800142Download as .RIS
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