Are BGAs a Concern in SMT? A User’s Point of View

X. Saint‐Martin (Bull, Les Clayes Sous Bois, France)
M. Auray (Bull Electronics Europe, Angers, France)
C. Floury (Bull Electronics Europe, Angers, France)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 1996


BGAs are a new type of surface mountable component. Successful industrial implementation of BGA assembly on electronic boards needs specific studies, evaluations and qualification. The methodology used in Bull is presented, along with an analysis of the different BGA types. Implementation and qualification results are provided.



Saint‐Martin, X., Stricot, Y., Auray, M. and Floury, C. (1996), "Are BGAs a Concern in SMT? A User’s Point of View", Microelectronics International, Vol. 13 No. 1, pp. 22-25.

Download as .RIS




Copyright © 1996, MCB UP Limited

Please note you might not have access to this content

You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account.
If you would like to contact us about accessing this content, click the button and fill out the form.
To rent this content from Deepdyve, please click the button.