Substrate materials that can be sintered at temperatures lower than 1000°C have been prepared and studied. The main compositions were achieved by adding low softening point glasses to cordierite. A 96‐97% relative density can be obtained for cordierite to which 50‐60 wt % borosilicate glass is added. The dielectric constants are approximately 5.5‐6.5, and the loss tangents are below 2% at 1 MHz. Lamination of five layers of the aforementioned material tape‐cast into green tapes (40 mm × 40 mm) can be sintered into a single substrate (34 mm × 34 mm). In addition, the compatibility between the substrate material and the inner electrode and buried resistor material has also been studied.
Fu, S., Chen, L. and Lu, J. (1996), "Low Temperature Sinterable Multilayer Glass‐ceramic Substrates", Microelectronics International, Vol. 13 No. 1, pp. 20-21. https://doi.org/10.1108/13565369610800133Download as .RIS
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