Low Temperature Sinterable Multilayer Glass‐ceramic Substrates

S.L. Fu (Kaohsiung Polytechnic Institute, Kaohsiung County, Taiwan, ROC)
L.S. Chen (Kaohsiung Polytechnic Institute, Kaohsiung County, Taiwan, ROC)
J.N. Lu (Kaohsiung Polytechnic Institute, Kaohsiung County, Taiwan, ROC)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 1996

Abstract

Substrate materials that can be sintered at temperatures lower than 1000°C have been prepared and studied. The main compositions were achieved by adding low softening point glasses to cordierite. A 96‐97% relative density can be obtained for cordierite to which 50‐60 wt % borosilicate glass is added. The dielectric constants are approximately 5.5‐6.5, and the loss tangents are below 2% at 1 MHz. Lamination of five layers of the aforementioned material tape‐cast into green tapes (40 mm × 40 mm) can be sintered into a single substrate (34 mm × 34 mm). In addition, the compatibility between the substrate material and the inner electrode and buried resistor material has also been studied.

Keywords

Citation

Fu, S., Chen, L. and Lu, J. (1996), "Low Temperature Sinterable Multilayer Glass‐ceramic Substrates", Microelectronics International, Vol. 13 No. 1, pp. 20-21. https://doi.org/10.1108/13565369610800133

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MCB UP Ltd

Copyright © 1996, MCB UP Limited

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