Finite element modeling of channel sag in LTCC

Abstract

Purpose

In microfluidic channel fabrication in low temperature co‐fired ceramics (LTCC), one of the biggest challenges is the elimination of channel deformation during lamination. The purpose of this paper is to describe the expected deformation of the substrate and the sacrificial layer (starch powder and 3D printed UV polymerized material) during the lamination process of microfluidic structure fabrication.

Design/methodology/approach

Uniaxial compression and Jenike shear test were used to obtain the mechanical parameters of starch sacrificial volume material (SVM). To determine the stress‐strain characteristics of LTCC a uniaxial compression experiment was conducted. The shape of the laminated LTCC containing embedded channel was modeled by finite element method using the mechanical parameters obtained by the measurements.

Findings

It was found that the choice of SVM plays an important role in channel deformation. A design rule is given considering the channel width and the choice of SVM based on the simulation results.

Originality/value

Until now the lamination step of LTCC technology was only optimized in an empirical way.

Citation

Horvath, E., Henap, G. and Harsanyi, G. (2012), "Finite element modeling of channel sag in LTCC", Microelectronics International, Vol. 29 No. 3, pp. 145-152. https://doi.org/10.1108/13565361211252908