TY  - JOUR
AB  - Purpose– The purpose of this paper is to investigate the effect of Al addition on the bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu (SAC105) solder alloy.Design/methodology/approach– The Sn‐1Ag‐0.5Cu‐xAl (x=0, 1, 1.5 and 2 wt.%) bulk solder specimens with flat dog‐bone shape were used for tensile testing in this work. The specimens were prepared by melting purity ingots of Sn, Ag, Cu and Al in an induction furnace. Subsequently, the molten alloys were poured into pre‐heated stainless steel molds, and the molds were naturally air‐cooled to room temperature. Finally, the molds were disassembled, and the dog‐bone samples were removed. The solder specimens were subjected to tensile testing on an INSTRON tester with loading rate 10−3 s−1. The microstructural analysis was carried out using scanning electron microscopy/Energy dispersive X‐ray spectroscopy. Electron Backscatter Diffraction (EBSD) analysis was used to identify the IMC phases. To obtain the microstructure, the solder samples were prepared by dicing, molding, grinding and polishing processes.Findings– The addition of Al to the SAC105 solder alloy suppresses the formation of Ag3Sn and Cu6Sn5 IMC particles and leads to the formation of larger Al‐rich and Al‐Cu IMC particles and a large amount of fine Al‐Ag IMC particles. The addition of Al also leads to refining of the primary β‐Sn grains. The addition of Al results in a significant increase on the elastic modulus and yield strength. On the other hand, the addition of Al drastically deteriorates the total elongation.Originality/value– The addition of Al to the low Ag‐content SAC105 solder alloy has been discussed for the first time. This work provides a starting‐point to study the effect of Al addition on the drop impact and thermal cycling reliability of the SAC105 alloy.
VL  - 29
IS  - 2
SN  - 1356-5362
DO  - 10.1108/13565361211237716
UR  - https://doi.org/10.1108/13565361211237716
AU  - Abdul‐Ameer Shnawah Dhafer
AU  - Faizul Mohd Sabri Mohd
AU  - Anjum Badruddin Irfan
AU  - Xing Che Fa
PY  - 2012
Y1  - 2012/01/01
TI  - The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐xAl lead‐free solder alloys (x=0, 1, 1.5 and 2 wt.%)
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
SP  - 108
EP  - 116
Y2  - 2024/04/26
ER  -