Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes
Article publication date: 4 May 2012
The purpose of this paper is to provide a systematic method to perform analysis and test for vibration‐thermal strain behavior of plastic ball grid array (PBGA) assembly by considering thermal and vibration loading mode. Also to investigate the dynamic behavior of PBGA assembly by considering loading modes for design and reliability evaluation of PBGA packaging.
A PBGA assembly prototype with different structure and material parameters is designed and manufactured. Based on investigation of the structural and physical parameters of PBGA sample, the vibration‐thermal strain test is developed to measure the strain distribution at the surface of the BT (bismaleimide triazine) substrates and PCB (printed circuit board) surface under vibration‐thermal cycling loading such as random vibration and the temperature is changed from 0°C to 100°C.
The test results show that the loading modes have different impact on PCB, EMC and substrate, respectively. In the meantime, it is shown that the characteristics of the compound mode is not the linear accumulative result by single vibration mode and single thermal loading mode as forecasted. The nonlinear mechanism for these modes application is the future work for progress.
It is very difficult to set up a numerical approach to illustrate the validity of the testing approach because the complex loading modes and the complex structure of PBGA assembly. The research on an accurate mathematical model of the PBGA assembly prototype is a future work.
It implies a potential design characteristic for future application of PBGA assembly. It also builds a basis for future work for design and reliability evaluation of BGA package.
This paper fulfils useful information about the thermal‐vibration coupling dynamic behavior of PBGA assembly with different structure characteristics, materials parameters.
Tan, G., Yang, P., Li, T., Xi, T., Yuan, X. and Yang, J. (2012), "Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes", Microelectronics International, Vol. 29 No. 2, pp. 71-75. https://doi.org/10.1108/13565361211237653
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