In today's electronic package development cycle, activities are managed by multiple participants in the supply chain, which might have different quality and reliability impacts to the end product. As a result, the reliability risk is much higher for companies who do not have insight into and/or control over the products received. The purpose of this paper is to show how design‐for‐reliability (DFR) approaches will come into play to manage the risk.
In this paper, DFR approaches for package development will be discussed from the perspective of the original equipment manufacturers (OEMs). DFR practices through the package development cycle will be described based on key development modules. A case study for flip chip ball gris array package development using an advanced Cu/Low‐k silicon technology will be presented. Key measures to help control the quality and improve the reliability will be presented.
The proposed methodology significantly improves component and package reliability through the engagement in design, manufacturing, assessment and system evaluation.
The paper discusses the research results and the proposed DFR methodology will be helpful for fabless design houses, electronics manufacturing service (EMS) partners in the supply chain, and OEMs to manage the reliability of the products.
Yang, L., Niu, R., Xie, J., Qian, B., Song, B., Rong, Q. and Bernstein, J. (2011), "Design‐for‐reliability implementation in microelectronics packaging development", Microelectronics International, Vol. 28 No. 1, pp. 29-40. https://doi.org/10.1108/13565361111097092Download as .RIS
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