Books and journals Case studies Expert Briefings Open Access
Advanced search

Design and analysis of a novel fine pitch and highly stretchable interconnect

Yung‐Yu Hsu (IMEC‐IPSI, Leuven, Belgium and Department of Materials Engineering, K.U. Leuven, Leuven, Belgium)
Mario Gonzalez (IMEC‐IPSI, Leuven, Belgium)
Frederick Bossuyt (IMEC‐CMST, Gent‐Zwijnaarde, Belgium)
Fabrice Axisa (IMEC‐CMST, Gent‐Zwijnaarde, Belgium)
Jan Vanfleteren (IMEC‐CMST, Gent‐Zwijnaarde, Belgium)
Bart Vandevelde (IMEC‐IPSI, Leuven, Belgium)
Ingrid de Wolf (IMEC‐IPSI, Leuven, Belgium and Department of Materials Engineering, K.U. Leuven, Leuven, Belgium)

Microelectronics International

ISSN: 1356-5362

Publication date: 26 January 2010

Abstract

Purpose

–

The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for “fine pitch” applications in stretchable electronics.

Design/methodology/approach

–

A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home‐built electromechanical measurement is carried out by the four‐probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading.

Findings

–

The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out‐of‐plane peeling, and strain localized at the crest of a zigzag structure.

Originality/value

–

In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.

Keywords

  • Deformation
  • Material‐deforming processes
  • Bonding
  • Films (states of matter)
  • Elastomers

Citation

Hsu, Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., Vandevelde, B. and de Wolf, I. (2010), "Design and analysis of a novel fine pitch and highly stretchable interconnect", Microelectronics International, Vol. 27 No. 1, pp. 33-38. https://doi.org/10.1108/13565361011009504

Download as .RIS

Publisher

:

Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

Please note you do not have access to teaching notes

You may be able to access teaching notes by logging in via Shibboleth, Open Athens or with your Emerald account.
Login
If you think you should have access to this content, click the button to contact our support team.
Contact us

To read the full version of this content please select one of the options below

You may be able to access this content by logging in via Shibboleth, Open Athens or with your Emerald account.
Login
To rent this content from Deepdyve, please click the button.
Rent from Deepdyve
If you think you should have access to this content, click the button to contact our support team.
Contact us
Emerald Publishing
  • Opens in new window
  • Opens in new window
  • Opens in new window
  • Opens in new window
© 2021 Emerald Publishing Limited

Services

  • Authors Opens in new window
  • Editors Opens in new window
  • Librarians Opens in new window
  • Researchers Opens in new window
  • Reviewers Opens in new window

About

  • About Emerald Opens in new window
  • Working for Emerald Opens in new window
  • Contact us Opens in new window
  • Publication sitemap

Policies and information

  • Privacy notice
  • Site policies
  • Modern Slavery Act Opens in new window
  • Chair of Trustees governance statement Opens in new window
  • COVID-19 policy Opens in new window
Manage cookies

We’re listening — tell us what you think

  • Something didn’t work…

    Report bugs here

  • All feedback is valuable

    Please share your general feedback

  • Member of Emerald Engage?

    You can join in the discussion by joining the community or logging in here.
    You can also find out more about Emerald Engage.

Join us on our journey

  • Platform update page

    Visit emeraldpublishing.com/platformupdate to discover the latest news and updates

  • Questions & More Information

    Answers to the most commonly asked questions here